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Summit Design Launches Intellectual Property Initiative to Enable Consistent, Pre-Verified, Multi-Vendor Compatible IP
Leveraging Its Customer-Proven Technology and Accepted Industry
Standards, Summit Proactively Addresses the Growing Demand for Better
IP Selection and Integration
LOS ALTOS, Calif.—(BUSINESS WIRE)—July 7, 2006—
Summit Design, Inc., a leading provider of electronic system-level
(ESL) and hardware description language (HDL) design solutions, today
announced the launch of its Intellectual Property (IP) Initiative
designed to proactively address IP interoperability issues at the
system-level. Through this initiative, Summit will 1) proactively work
with IP vendors to build and distribute a library of transaction-level
IP models that are pre-tested to work together, and 2) further equip
these IP models for system-level design analysis, debugging,
architectural exploration, and performance analysis.
Effective SoC design requires high levels of IP assembly and
reuse. However, there is a profusion of disparate TLM methodologies
causing interoperability issues to persist. IP Vendors support a
variety of operating systems (OS) flavors or versions; such as GNU and
Visual C++. They also support multiple simulation environments, such
as the OSCI simulator, various proprietary simulators, mixed-language
simulators, etc. This eclectic mix only further complicates the
customers' interoperability issues and forces them to bear the costly
and time-consuming burden of getting IP to work within their system
chips. OSCI is continuing to enhance the TLM standard. Working with IP
vendors, Summit will further the support of this evolving standard
while addressing the interoperability issues not yet addressed.
Under its IP Initiative, Summit will work with IP partners to
address these interoperability issues and to define, drive, and
provide a library of SystemC transaction-level models (TLM). Summit
will leverage the open source common infrastructures, including the
Open SystemC Initiative (OSCI) reference simulator, and its OSCI TLM
standard, the Open Core Protocol International Partnership (OCP-IP)
TLM bus interface standard, and the GNU C Compiler. Through Summit's
initiative, partner IP will be enhanced to support of advanced
analysis, debugging, and design management features using Summit's
Vista(TM) and Visual Elite(TM), and annotated with calls for
architecture exploration, component selection, parameterization, and
virtual product management (VPM) using Summit's Panorama(TM). Summit
will also distribute and perform first-level support for this library
of components tailored to work together with enhanced capabilities.
"Our customers have told us that it takes them upwards of 2-3
man-months for a complex IP block to resolve interoperability
problems," said Emil Girczyc, Summit's president and CEO. "We were
resolving issues at customer sites together with IP vendors when we
recognized the tremendous need for reliable vendor-supplied high-level
models. We understood that what was really needed was an IP initiative
that could solve these problems proactively, as opposed to at the
customer site. By working with IP vendors, we can fully enable
advanced features and enhance interoperability between IP vendors."
Summit's IP Initiative benefits customers by focusing on
addressing IP interoperability issues. It will deliver considerable
value to customers by enabling IP to be shipped in a standard model
selection platform using Panorama. Customers will also be able to
appropriately configure the IP, do architectural exploration and
performance analysis, and benefit from advanced debugging features
which would be made available within the IP of each initiative
partner. Summit's IP Initiative will accelerate refinement and support
for a TLM modeling standard, and availability of golden models from
the IP vendor. Ultimately, the Initiative makes it possible for the IP
of all the Initiative partners to work together, serving to accelerate
system-level IP adoption.
Demonstrations of Vista, Visual Elite, and Panorama will be
provided on July 24-27, 2006, in Summit Design's booth #1028 at the
Design Automation Conference (DAC) located within the Moscone
Convention Center in San Francisco, California. Summit will also
highlight the benefits of its IP Initiative at demonstrations held at
the Summit Design booth. To book time with Summit's ESL and HDL
experts, please call +1-650-564-0010 ext. 810 or email info@sd.com to
request a private demo.
To learn more about Summit's IP initiative, register to attend the
4th annual DAC ESL technology symposium hosted by Summit Design,
"Putting ESL to Work: Successful IP Selection, Integration, and
Interoperability for Effective ESL Design". The symposium is being
held at the Moscone Convention Center, in room 200 on Tuesday, July
25, 12:00 - 2:00 p.m. Registration is available at
http://www.sd.com/news_events/events/.
About Summit Design
Summit Design's industry-leading ESL and HDL solutions enable SOC
companies to deliver products that meet system-level performance and
power targets with dramatically reduced schedule risk. Summit's
products address engineering challenges met during the specification
and implementation design phases of complex hardware/software systems.
Panorama(TM) allows designers to perform real-time application
emulation of both the hardware and software portions of an embedded
SoC, before core and IP selections are finalized. Vista(TM) is an
integrated development environment (IDE) for SystemC that combines
both hardware and software concepts to speed design and debug of
SystemC and TLM applications. Visual Elite(TM) is a state-of-the-art
design, integration and verification platform which enables designers
to intuitively capture and validate their designs using high-level
design techniques and languages. Top electronics companies worldwide,
including leaders in the wireless, automotive, and consumer
electronics space, have achieved dramatic reductions in design cycle
time through their use of Summit's products. Summit Design is
headquartered in Los Altos, California, with offices throughout the
US, Europe, Japan, Israel, and ROA. To learn more, please visit
http://www.sd.com.
All trademarks or registered trademarks mentioned in this news
release are the intellectual property of their respective owners.
Contact:
For Summit Design, Inc.
Francine Bacchini, 408-839-8153
Email Contact
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